ETSOI Substrates: What We Needi
IBM’s roadmap to ETSOI – Extremely Thin Silicon on Insulator – calls for very thin, very flat SOI substrates. Here’s why. ETSOI transistors are thin-channel planar devices. Halo implantation is used to...
View ArticleWelcome to IEEE S3S – the World’s Leading Conference for SOI, 3DI and Sub Vt...
(For best rates, register by September 18th.) The 2014 IEEE SOI-3DI–Subthreshold (S3S) Microelectronics Technology Unified Conference will take place from Monday October 6 through Thursday October 8 in...
View ArticleGreat line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October,...
Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in the areas of process integration, advanced materials &...
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